Images of what is claimed to be part of the motherboard from Apple’s next-generation iPhone 5S handset leaked on Thursday. The photos were originally published by Japan-based cell phone parts and accessories vendor Moumantai, and they show redesigned internal components that suggest earlier rumors claiming the iPhone 5S will include an upgraded rear camera may be accurate. Apple’s next iPhone is expected to launch this fall with an upgraded processor and a new camera, which may feature 12-megapixel resolution and improved low-light image capture capabilities. The photos of the purported iPhone 5S part, which features a new shape and redesigned connectors, follow below alongside comparison shots of the iPhone 5 motherboard.
This article was originally published on BGR.com
<By Zach Epstein | BGR News – Thu, May 9, 2013>
